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Technical Program Committee Members
PHY Track
- Taufik Abrao, State University of Londrina, Brazil
- Walid Ahmed, Broadcom Inc., USA
- Abdeldjalil Aissa-El-Bey, TELECOM Bretagne, France
- Defne Aktas, Bilkent University, Turkey
- Emre Aktas, Hacettepe University, Turkey
- Tareq Al-Naffouri, King Fahd University of Petroleum and Minerals, USA
- Temitope Alade, University of Kent, United Kingdom
- Emad Alsusa, Manchester University, United Kingdom
- Yiannis Andreopoulos, University College London, United Kingdom
- Carles Anton-Haro, Centre Tecnologic de Telecomunicacions de Catalunya (CTTC), Spain
- Theodore Antonakopoulos, University of Patras, Greece
- Khoirul Anwar, Japan Advanced Institute of Science and Technology, Japan
- Masoud Ardakani, University of Alberta, Canada
- Edward Au, Huawei Technologies, Canada
- Faouzi Bader, CTTC, Spain
- Dongwoon Bai, Samsung US R&D Center, USA
- Zhiquan Bai, Shandong University, P.R. China
- Mayank Bakshi, The Chinese University of Hong Kong, USA
- Bernd Bandemer, University of California, San Diego, USA
- Adrish Banerjee, Indian Institute of Technology, Kanpur, India
- Luca Barletta, Politecnico di Milano, Italy
- Mehdi Bennis, Centre of Wireless Communications, University of Oulu, Finland
- Kostas Berberidis, University of Patras, Greece
- Manav Bhatnagar, Indian Institute of Technology Delhi, India
- Ranjan Bose, Indian Institute of Technology, India
- Marie-Laure Boucheret, University of Toulouse IRIT Enseeiht, France
- Yu Cai, Michigan Technological University, USA
- Gustavo Camps-Valls, Universitat de Valencia, Spain
- Hasari Celebi, Gebze Institute of Technology, Turkey
- Raphael Cendrillon, Google, USA
- Dah-Chung Chang, National Central University, Taiwan
- KyungHi Chang, Inha University, Korea
- Li-Chung Chang, National Taiwan University of Science and Technology, Taiwan
- Wen Chen, Shanghai Jiao Tong University, P.R. China
- Xiang Chen, Tsinghua University, P.R. China
- Yifan Chen, South University of Science and Technology of China, P.R. China
- Samuel Cheng, University of Oklahoma, USA
- Yu Cheng, Illinois Institute of Technology, USA
- Man Hon Cheung, The Chinese University of Hong Kong, Hong Kong
- Yuejie Chi, Ohio State University, USA
- Marco Chiani, University of Bologna, Italy
- Wen-Long Chin, National Cheng Kung University, Taiwan
- A. Chockalingam, Indian Institute of Science, India
- Ji-Woong Choi, DGIST, Korea
- Jihwan Choi, Marvell, USA
- Wan Choi, KAIST, Korea
- Theofilos Chrysikos, University of Patras, Greece
- Xiaowen Chu, Hong Kong Baptist University, Hong Kong
- Jaehak Chung, Inha University, Korea
- Hakan Cirpan, Istanbul Technical University, Turkey
- Andrea Conti, ENDIF University of Ferrara, WiLAB University of Bologna, Italy
- Giovanni Emanuele Corazza, University of Bologna, Italy
- Roberto Corvaja, University of Padova, Italy
- Paul Cotae, University of The District of Columbia, USA
- Tao Cui, California Institute of Technology, USA
- Daniel Benevides da Costa, Federal University of Ceara (UFC), Brazil
- Ron Dabora, Ben-Gurion University, Israel
- Hayssam Dahrouj, University of Toronto, Canada
- Lin Dai, City University of Hong Kong, Hong Kong
- Zaher Dawy, American University of Beirut, Lebanon
- Rodrigo de Lamare, University of York, United Kingdom
- Javier Del Ser, TECNALIA, Spain
- Nikos Deligiannis, Vrije Universiteit Brussel - IBBT, Belgium
- Prathapasinghe Dharmawansa, Stanford University, USA
- Fabian Diehm, Technische Universitat Dresden, Germany
- Guido Dietl, University of Applied Sciences Landshut, Germany
- Goran Dimic, University of Belgrade, Serbia
- Rui Dinis, ISR-IST, Technical University of Lisbon, Portugal
- Aleksandar Dogandzic, Iowa State University, USA
- Min Dong, University of Ontario Institute of Technology, Canada
- Xiaodai Dong, University of Victoria, Canada
- Yinggang Du, Huawei Technologies Co., Ltd, P.R. China
- Gregory Durgin, Georgia Tech, USA
- Giuseppe Durisi, Chalmers University of Technology, Sweden
- George Efthymoglou, University of Piraeus, Greece
- Maged Elkashlan, Queen Mary, University of London, United Kingdom
- Serhat Erkucuk, Kadir Has University, Turkey
- Gianluigi Ferrari, University of Parma, Italy
- Inbar Fijalkow, ETIS, CNRS, ENSEA, UniversityCergy-Pontoise, France
- Paul Fortier, Laval University, Canada
- Feifei Gao, Tsinghua University, P.R. China
- Ana Garcia Armada, Universidad Carlos III de Madrid, Spain
- Parul Garg, Netaji Subhas Institute of Technology, New Delhi, India
- Rizwan Ghaffar, University of Waterloo, Canada
- Gaetano Giunta, University of "Roma TRE", Italy
- Ramy Gohary, Carleton University, Canada
- Tiangao Gou, University of California Irvine, USA
- Alexandre Graell i Amat, Chalmers University of Technology, Sweden
- Yong Liang Guan, Nanyang Technological University, Singapore
- T. Aaron Gulliver, University of Victoria, Canada
- Ozgur Gurbuz, Sabanci University, Turkey
- Mustafa Gurcan, Imperial College London, United Kingdom
- Martin Haenggi, University of Notre Dame, USA
- Khairi Hamdi, University of Manchester, United Kingdom
- Lajos Hanzo, University of Southampton, United Kingdom
- Mazen Hasna, Qatar University, Qatar
- Hiroyuki Hatano, Shizuoka University, Japan
- Kazunori Hayashi, Kyoto University, Japan
- Gaoning He, Huawei Technologies, P.R. China
- Jianqiang He, Qualcomm Inc., USA
- Maryline Helard, INSA Rennes, France
- Kenichi Higuchi, Tokyo University of Science, Japan
- Chin Keong Ho, Institute for Infocomm Research, A*STAR, Singapore
- Ivan Wang-Hei Ho, The Hong Kong Polytechnic University, Hong Kong
- Daesik Hong, Yonsei University, Korea
- Die Hu, Fudan University, P.R. China
- Sha Hua, Polytechnic Institute of New York University, USA
- Wan-Jen Huang, National Sun Yat-Sen University, Taiwan
- Yongming Huang, Southeast University, P.R. China
- Aissa Ikhlef, University of British Columbia, Canada
- Gi-Hong Im, POSTECH, Korea
- Muhammad Ali Imran, University of Surrey, United Kingdom
- Syed Jafar, University of California Irvine, USA
- Sidharth Jaggi, Chinese University of Hong Kong, Hong Kong
- Tara Javidi, UCSD, USA
- Anagiyaddage Jayalath, Queensland University of Technology, Australia
- Meilong Jiang, InterDigital Communications, LLC, USA
- Tao Jiang, Huazhong University of Science and Technology, P.R. China
- Shi Jin, Southeast University, P.R. China
- Yindi Jing, University of Alberta, Canada
- Hakan Johansson, University of Linkoping, Sweden
- Jingon Joung, Institute for Infocomm Research, Singapore
- Bang Chul Jung, Gyeongsang National University, Korea
- Aravind Kailas, University of North Carolina at Charlotte, USA
- Mohammed Kamoun, CEA-LIST, France
- George Karagiannidis, Aristotle University of Thessaloniki, Greece
- Abhay Karandikar, IIT Bombay, India
- George Karystinos, Technical University of Crete, Greece
- Onur Kaya, Isik University, Turkey
- Hongseok Kim, Sogang University, Korea
- Hoon Kim, National University of Singapore, Singapore
- Kwang Soon Kim, Yonsei University, Korea
- Anja Klein, TU Darmstadt, Germany
- Young-Chai Ko, Korea University, Korea
- Kentaro Kobayashi, Nagoya University, Japan
- Mutlu Koca, Bogazici University, Turkey
- Constantine Kotropoulos, Aristotle University of Thessaloniki, Greece
- Marios Kountouris, Supelec, France
- Witold Krzymien, University of Alberta / TRLabs, Canada
- Riichi Kudo, NTT Corporation, Japan
- Hyukjoon Kwon, Samsung US R&D Center, USA
- Tian Lan, George Washington University, USA
- Erik G. Larsson, Linkoping University, Sweden
- Samson Lasaulce, CNRS - Supelec, France
- Francis Lau, The Hong Kong Polytechnic University, Hong Kong
- Vincent Lau, Hong Kong University of Science and Technology, Hong Kong
- Didier Le Ruyet, CNAM, France
- Jemin Lee, Massachusetts Institute of Technology, USA
- Jungwon Lee, Samsung US R&D Center, USA
- Kyoung-Jae Lee, University of Texas at Austin, USA
- Tsair-Fwu Lee, National Kaohsiung University of Applied Sciences, Taiwan
- Xianfu Lei, Utah State University, USA
- Zander Lei, Institute for Infocomm Research, Singapore
- Shu-hung Leung, City University of Hong Kong, Hong Kong
- Kwok Li, Nanyang Technological University, Singapore
- Yang Li, Samsung Research America (Dallas), USA
- Yonghui Li, University of Sydney, Australia
- Yunzhou Li, Tsinghua University, P.R. China
- Hai Lin, Osaka Prefecture University, Japan
- Jia-Chin Lin, National Central University, Taiwan
- Shan Lin, Temple University, USA
- Shou-Sheu Lin, National Kaohsiung First University of Science and Technology, Taiwan
- Hsin-Chin Liu, National Taiwan University of Science and Technology, Taiwan
- Nan Liu, Southeast University, P.R. China
- Xin Liu, Brookhaven National Laboratory, USA
- Angelos Liveris, Microwave Networks Inc, USA
- Ernest Lo, Centre Tecnològic de Telecomunicacions de Catalunya, Hong Kong
- Yves Lostanlen, SIRADEL, Canada
- Vincenzo Lottici, University of Pisa, Italy
- Jerome Louveaux, Universite Catholique de Louvain, Belgium
- Hancheng Lu, University of Science and Technology of China, P.R. China
- Hoang-Yang Lu, National Taiwan Ocean University, Taiwan
- Kejie Lu, University of Puerto Rico at Mayaguez, Puerto Rico
- Lu Lu, The Chinese University of Hong Kong, Hong Kong
- Songwu Lu, University of California at Los Angeles, USA
- Jie Luo, Colorado State University, USA
- Hsi-Pin Ma, National Tsing Hua University, Taiwan
- Amine Maaref, Huawei Technologies Canada, Canada
- A Madhukumar, Nanyang Technological University, Singapore
- Behrouz Maham, University of Tehran, Iran
- Ranjan Mallik, Indian Institute of Technology - Delhi, India
- Konstantinos Mammasis, University of Patras, Greece
- Eduardo Martos-Naya, University of Malaga, Spain
- Christos Masouros, University College London, United Kingdom
- Michail Matthaiou, Chalmers University of Technology, Sweden
- Steve McLaughlin, Heriot Watt University, United Kingdom
- Ricardo Merched, Universidade Federal do Rio de Janeiro, Brazil
- Diomidis Michalopoulos, University of British Columbia, Canada
- Hlaing Minn, University of Texas at Dallas, USA
- Satyajayant Misra, New Mexico State University, USA
- Patrick Mitran, University of Waterloo, Canada
- Hichan Moon, Hanyang University, Korea
- Marco Moretti, Universita di Pisa, Italy
- Mohamed Moustafa, Arab Information Union, Egypt
- Aris Moustakas, University of Athens, Greece
- Wai Ho Mow, Hong Kong University of Science and Technology, Hong Kong
- Sami Muhaidat, Khalifa University, UAE
- Sayandev Mukherjee, DOCOMO Innovations Inc., USA
- Chandra Murthy, Indian Institute of Science, India
- Arumugam Nallanathan, King's College London, United Kingdom
- Mort Naraghi-Pour, Louisiana State University, USA
- Majid Nasiri Khormuji, KTH Royal Institute of Technology, Sweden
- Derrick Wing Kwan Ng, University Erlangen-Nurnberg, Germany
- Tungsang Ng, University of Hong Kong, Hong Kong
- Ha X. Nguyen, Tan Tao University, Vietnam
- Hoang Nguyen, Samsung Telecom America, USA
- Hung Nguyen, The Aerospace Corporation, USA
- Hideki Ochiai, Yokohama National University, Japan
- Seong-Jun Oh, Korea University, Korea
- Hiraku Okada, Nagoya University, Japan
- Zhiwen Pan, Southeast University, P.R. China
- Athanasios Panagopoulos, National Technical University of Athens, Greece
- Erdal Panayirci, Kadir Has University, Turkey
- Nikolaos Papandreou, IBM Research - Zurich, Switzerland
- Jose Francisco Paris, University of Malaga, Spain
- Hyuncheol Park, KAIST, Korea
- Wei Peng, Tohoku University, Japan
- Kostas Peppas, NCSR "Demokritos", Greece
- Stephan Pfletschinger, Centre Tecnologic de Telecomunicacions de Catalunya (CTTC), Spain
- Li Ping, City University of Hong Kong, Hong Kong
- Shankar Prakriya, Indian Institute of Technology, Delhi, India
- Pravinkumar Premakanthan, Research and Development Systems Engineer, USA
- Ioannis Psaromiligkos, McGill University, Canada
- Chenhao Qi, Southeast University, P.R. China
- Qi Qi, LSI Corporation, USA
- Ling Qiu, PCN&SS Lab, P.R. China
- Tony Q. S. Quek, Singapore University of Technology and Design (SUTD), Singapore
- B. Sundar Rajan, Indian Institute of Science, India
- Lars K. Rasmussen, KTH Royal Institute of Technology, Sweden
- Adeel Razi, University College London, United Kingdom
- Yong Man Ro, KAIST, Korea
- Juan Romero-Jerez, University of Malaga, Spain
- George Ropokis, Research Academic Computer Technology Institute, Greece
- Yun Rui, Shanghai Advanced Research Institute Chinese Academy of Sciences, P.R. China
- Heung-Gyoon Ryu, Chungbuk National University, Korea
- Takahiko Saba, Chiba Institute of Technology, Japan
- Ashutosh Sabharwal, Rice University, USA
- Hamid Saeedi, Tarbiat Modarres University, Iran
- Zoltan Safar, University of Maryland College Park, USA
- Nikos Sagias, University of Peloponnese, Greece
- Saeid Sanei, University of Surrey, United Kingdom
- Samir Saoudi, Telecom-Bretagne, France
- Robert Schober, University of British Columbia, Canada
- Gesualdo Scutari, State University of New York at Buffalo, USA
- Mathini Sellathurai, Heriot-Watt University, United Kingdom
- Serdar Sezginer, Sequans, France
- Mohammad Shaqfeh, Texas A&M University at Qatar, Qatar
- Yi Shi, Intelligent Automation Inc., USA
- Byonghyo Shim, Korea University, Korea
- Shigeru Shimamoto, Waseda University, Japan
- Hyundong Shin, Kyung Hee University, Korea
- Oh-Soon Shin, Soongsil University, Korea
- Adao Silva, Instituto de Telecomunicacoes (IT)/University of Aveiro, Portugal
- Daniel K. C. So, University of Manchester, United Kingdom
- Hing Cheung So, City University of Hong Kong, Hong Kong
- Ju Bin Song, Kyung Hee University, Korea
- Lingyang Song, Peking University, P.R. China
- Shenghui Song, The Hong Kong University of Science and Technology, Hong Kong
- Vladimir Stankovic, University of Strathclyde, United Kingdom
- Igor Stanojev, University of Wisconsin-Platteville, USA
- Stavros Stavrou, Open University of Cyprus, Cyprus
- Heidi Steendam, Ghent University, Belgium
- Hsuan-Jung Su, National Taiwan University, Taiwan
- Weifeng Su, State University of New York at Buffalo, USA
- Yu Ted Su, National Chiao Tung University, Taiwan
- Changho Suh, MIT, USA
- Wonjin Sung, Sogang University, Korea
- Himal Suraweera, Singapore University of Technology and Design, Singapore
- Tommy Svensson, Chalmers University of Technology, Sweden
- Joseph Tabrikian, Ben-Gurion University of the Negev, Israel
- Osamu Takyu, Shinshu University, Japan
- Peng Hui Tan, Institute for Infocomm Research, Singapore
- Xiaojun Tang, AT&T Labs, Inc., USA
- Tomohiko Taniguchi, Fujitsu Laboratories Ltd., Japan
- Meixia Tao, Shanghai Jiao Tong University, P.R. China
- Hidekazu Taoka, DOCOMO Euro-Labs, Germany
- Chintha Tellambura, University of Alberta, Canada
- Antti Tolli, University of Oulu, Finland
- George Tombras, National and Kapodistrian University of Athens, Greece
- Murat Torlak, The University of Texas at Dallas, USA
- Dimitris Toumpakaris, University of Patras, Greece
- Theodoros Tsiftsis, Technological Educational Institute of Lamia, Greece
- Charalampos Tsimenidis, Newcastle University, United Kingdom
- Christos Tsinos, University of Patras, Greece
- George Tsoulos, University of Peloponnese, Greece
- Hoang Tuan, University of Technology, Sydney, Australia
- Ufuk Tureli, Bahcesehir University, Turkey
- Piotr Tyczka, Poznan University of Technology, Poland
- Momin Uppal, Lahore University of Management Sciences, Pakistan
- Murat Uysal, Ozyegin University, Turkey
- Shahrokh Valaee, University of Toronto, Canada
- João Vilela, University of Coimbra, Portugal
- Giorgio M. Vitetta, University of Modena and Reggio Emilia, Italy
- Azadeh Vosoughi, University of Central Florida, USA
- Mai Vu, Tufts University, USA
- John Walsh, Drexel University, USA
- Fanggang Wang, Beijing Jiaotong University, P.R. China
- Lei Wang, University of Connecticut, USA
- Peng Wang, The University of Sydney, Australia
- Shuang Wang, University of California, San Diego, USA
- Yue Wang, Toshiba Research Europe Limited, United Kingdom
- Yufeng Wang, University of South Florida, USA
- Chin-Der Wann, National Kaohsiung First University of Science and Technology, Taiwan
- Ian Wells, Swansea Metropolitan University, United Kingdom
- Chao-Kai Wen, National Sun Yat-Sen University, Taiwan
- Risto Wichman, Aalto University School of Electrical Engineering, Finland
- Thakshila Wimalajeewa, Syracuse University, USA
- Kainam Wong, Hong Kong Polytechnic University, Hong Kong
- Yan Wu, Eindhoven University of Technology, The Netherlands
- Yik-Chung Wu, The University of Hong Kong, Hong Kong
- Dirk Wubben, University of Bremen, Germany
- Henk Wymeersch, Chalmers University of Technology, Sweden
- Xiang-Gen Xia, University of Delaware, USA
- Liang Xiao, Xiamen University, P.R. China
- Pei Xiao, University of Surrey, United Kingdom
- Chengwen Xing, Beijing Institute of Technology, P.R. China
- Mingguang Xu, Marvell Semiconductor, Inc, USA
- Wei Xu, Southeast University, P.R. China
- Hideki Yagi, University of Electro-Communications, Japan
- Chenyang Yang, Beihang University, P.R. China
- Tao Yang, CSIRO, Australia
- Yaoqing (Lamar) Yang, University of Nebraska-Lincoln, USA
- Ping-Cheng Yeh, National Taiwan University, Taiwan
- Makoto Yoshida, Fujitsu Laboratories Ltd., Japan
- Xiaojun Yuan, The Chinese University of Hong Kong, Hong Kong
- Chau Yuen, Singapore University of Technology and Design, Singapore
- Yuriy Zakharov, University of York, United Kingdom
- Alberto Zanella, Istituto di Elettronica e di Ingegneria dell’Inform. e delle Telecomunicazioni, Italy
- Seyed (Reza) Zekavat, Michigan Technological University, USA
- Jianqiang Zeng, Freescale Semiconductor, USA
- Yonghong Zeng, Institute for Infocomm Research, Singapore
- Honghai Zhang, Google, USA
- Jian Zhang, Broadcom, USA
- Jun Zhang, The Hong Kong University of Science and Technology, Hong Kong
- Keith Q. T. Zhang, City University of Hong Kong, Hong Kong
- Li Zhang, University of Leeds, United Kingdom
- Rui Zhang, National University of Singapore, Singapore
- Shengli Zhang, Shenzhen University, P.R. China
- Shunqing Zhang, Huawei Technologies, Co. Ltd., P.R. China
- Wei Zhang, The University of New South Wales, Australia
- Wenyi Zhang, University of Science and Technology of China, P.R. China
- Yimin Zhang, Villanova University, USA
- H. Vicky Zhao, University of Alberta, Canada
- Miao Zhao, Multimedia Networking Research Lab of Huawei Technologies, USA
- Fu-Chun Zheng, The University of Reading, United Kingdom
- Xiaofeng Zhong, Tsinghua University, P.R. China
- Bo Zhou, Qualcomm Inc., USA
- Lei Zhou, University of Toronto, Canada
- Wuyang Zhou, University of Science and Technology of China, P.R. China
- Xiaolin Zhou, Fudan University, P.R. China
- Huiling Zhu, University of Kent, United Kingdom
- Xu Zhu, University of Liverpool, United Kingdom
- Yu Zhu, Fudan University, P.R. China
- Adamu Murtala Zungeru, University of Nottingham Malaysia Campus, Malaysia
MAC Track
- Santosh Abraham, Qualcomm Inc., USA
- Koichi Adachi, Institute for Infocomm Research (I2R), Singapore
- Sonia Aissa, INRS, University of Quebec, Canada
- Anwer Al-Dulaimi, Brunel University, United Kingdom
- Ala Al-Fuqaha, Western Michigan University, USA
- Saba AL-Rubaye, Brunel University, United Kingdom
- Temitope Alade, University of Kent, United Kingdom
- Weng Chon Ao, University of Southern California, USA
- Sibi Raj B Pillai, IIT Bombay, India
- Krishna Balachandran, Bell Labs, Alcatel-Lucent, USA
- Osman Balta, University of Bonn, Germany
- Srikrishna Bhashyam, Indian Institute of Technology Madras, India
- Suzhi Bi, The Chinese University of Hong Kong, Hong Kong
- Alessandro Bogliolo, University of Urbino, Italy
- Pascal Bouvry, University of Luxembourg, Luxemburg
- Fu Cai, HuaZhong University of Science and Technology, P.R. China
- Lin Cai, University of Victoria, Canada
- Lin Cai, Huawei, USA
- Jiannong Cao, Hong Kong Polytechnic Univ, Hong Kong
- Mun Choon Chan, National University of Singapore, Singapore
- Jau-Yang Chang, National Formosa University, Taiwan
- Yeim-Kuan Chang, National Cheng Kung University, Taiwan
- Chih-Min Chao, National Taiwan Ocean University, Taiwan
- Hsi-Lu Chao, National Chiao Tung University, Taiwan
- Ioannis Chatzigiannakis, Research Academic Computer Technology Institute, Greece
- Chi-Kin Chau, Masdar Institute, UAE
- Yawgeng Chau, Yuan Ze University, Taiwan
- Ai Chen, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P.R. China
- Chao-Lieh Chen, National Kaohsiung First University of Science and Technology, Taiwan
- Chi-Ming Chen, AT&T, USA
- Chung Shue Chen, Alcatel-Lucent Bell Labs, France
- Jyh-Cheng Chen, National Chiao Tung University, Taiwan
- Lan Chen, DOCOMO Beijing Communication Laboratories Co., Ltd, P.R. China
- Ling-Jyh Chen, Academia Sinica, Taiwan
- Sheng Chen, University of Southampton, United Kingdom
- Wei Chen, Tsinghua University, P.R. China
- Xu Chen, Arizona State University, USA
- Yejian Chen, Alcatel-Lucent, Bell Laboratories, Germany
- Yen-Wen Chen, National Central University, Taiwan
- Yi Chen, The Chinese University of HongKong, Hong Kong
- Yu Chen, State University of New York - Binghamton, USA
- Yung-Fang Chen, National Central University, Taiwan
- Chia-Hsin Cheng, National Formosa University, Taiwan
- Chien-Fu Cheng, Tamkang University, Taiwan
- Harsha Chenji, Texas A&M University, USA
- Tai-Lin Chin, National Taiwan University of Science and Technology, Taiwan
- Bong Dae Choi, Korea University, Korea
- Jinho Choi, Swansea University, United Kingdom
- Cheng-Fu Chou, NTU, Taiwan
- Xiaoli Chu, University of Sheffield, United Kingdom
- Mooi Choo Chuah, Lehigh University, USA
- Jose Claver, Universidad de Valencia, Spain
- Marian Codreanu, University of Oulu, Finland
- Carlos Cordeiro, Intel Corporation, USA
- Yong Cui, Tsinghua University, P.R. China
- Swades De, Indian Institute of Technology, Delhi, India
- Lianghui Ding, Shanghai Jiao Tong University, P.R. China
- Jun Du, NEC labs China, P.R. China
- Xiaojiang Du, Temple University, USA
- Lingjie Duan, Singapore University of Technology and Design (SUTD), Singapore
- Trung Q. Duong, Blekinge Institute of Technology, Sweden
- Zbigniew Dziong, Ecole de technologie superieure, University of Quebec, Canada
- Mourad Elhadef, University of Ottawa, Canada
- Tomaso Erseghe, University of Padova, Italy
- Pingyi Fan, Tsinghua University, P.R. China
- Pingzhi Fan, Southwest Jiaotong Universityiversity, P.R. China
- Zhong Fan, Toshiba Research Europe, United Kingdom
- Abraham Fapojuwo, University of Calgary, Canada
- Afef Feki, Bell Labs - Alcatel Lucent - France, France
- Zhiyong Feng, Beijing University of Posts and Telecommunications, P.R. China
- Michael Fitch, BT Exact, United Kingdom
- Antoine Fraboulet, INSA de Lyon / INRIA, France
- Vasilis Friderikos, King's College London, United Kingdom
- Liqun Fu, The Chinese University of Hong Kong, Hong Kong
- Rung-Hung Gau, National Chiao Tung University, Taiwan
- Matthieu Gautier, University of Rennes, IRISA, INRIA, France
- Yu Ge, Institute for Infocomm Research, Singapore
- Thanassis Giannetsos, Athens Information Technology, Greece
- Nada Golmie, NIST, USA
- Yi Gong, Nanyang Technological University, Singapore
- Yu Gu, National Institute of Informatics, Japan
- Dongning Guo, Northwestern University, USA
- Linke Guo, University of Florida, USA
- Wenzhong Guo, Fuzhou University, P.R. China
- Ismail Guvenc, Florida International University, USA
- Mounir Hamdi, Hong Kong University of Science and Technology, P.R. China
- Guangjie Han, Hohai University, P.R. China
- Miin Jong Hao, NKFUST, Taiwan
- Xiang He, Microsoft, USA
- Ivan Wang-Hei Ho, The Hong Kong Polytechnic University, Hong Kong
- Oliver Holland, King's College London, United Kingdom
- Hung-Yun Hsieh, National Taiwan University, Taiwan
- S-c Huang, National formosa university, Taiwan
- Xinming Huang, Worcester Polytechnic Institute, USA
- Ganguk Hwang, KAIST, Korea
- Takashi Ikegawa, Nippon Telegraph and Telephone Corporation, Japan
- Muhammad Ilyas, National University of Sciences & Technology, Pakistan
- Hidenori Ishihara, Kagawa University, Japan
- Hiroyuki Ishihara, Okayama University, Japan
- Susumu Ishihara, Shizuoka University, Japan
- Tingfang Ji, Qualcomm Inc., USA
- Xiaohong Jiang, Future University-Hakodate, Japan
- Xin Jin, The University of Hong Kong, Hong Kong
- Emmanouil Kafetzakis, NCSR Demokritos, Greece
- Dritan Kaleshi, University of Bristol, United Kingdom
- Pooi-Yuen Kam, National University of Singapore, Singapore
- Farah Kandah, University of Tennessee at Chattanooga, USA
- Joseph Kang, Bell Labs, Alcatel-Lucent, USA
- Mehmet Kemal Karakayali, Bell Labs, Alcatel-Lucent, USA
- Ahmed Karmouch, University of Ottawa, Canada
- Kazuki Katagishi, University of Tsukuba, Japan
- Tetsuya Kawanishi, National Institute of Information and Communications Technology, Japan
- Hidetoshi Kayama, DOCOMO Beijing Communications Laboratories Co., Ltd., P.R. China
- Chih-Heng Ke, National Kinmen Institute of Technology, Taiwan
- Samee Khan, North Dakota State University, USA
- Hwangnam Kim, Korea University, Korea
- Young Kim, Yonsei University, Korea
- Shigetomo Kimura, University of Tsukuba, Japan
- Yoshihisa Kishiyama, NTT DOCOMO, INC., Japan
- Zhen Kong, University of Hong Kong, Hong Kong
- Zhen Kong, Wayne State University, USA
- Meng-lin Ku, National Central University, Taiwan
- Parag Kulkarni, Toshiba Research Europe Ltd., United Kingdom
- Raghavendra Kulkarni, Missouri University of Science and Technology- Rolla, USA
- Ko-Chi Kuo, National Sun Yat-sen University, Taiwan
- Raymond Kwan, Ubiquisys, United Kingdom
- Yu-Kwong Kwok, University of Hong Kong, Hong Kong
- Chin-Feng Lai, National Ilan University, Taiwan
- Francis Lau, The University of Hong Kong, Hong Kong
- Wing Cheong Lau, The Chinese University of Hong Kong, Hong Kong
- Patrick Pak-Ching Lee, The Chinese University of Hong Kong, Hong Kong
- Chih-Peng Li, National Sun Yat-sen University, Taiwan
- Jie Li, University of Tsukuba, Japan
- Peng Li, The University of Aizu, Japan
- Ruidong Li, National Institute of Information and Communications Technology (NICT), Japan
- William Wei-Liang Li, University of California, Santa Barbara, USA
- Yabo Li, Zhejiang University, P.R. China
- Yaping Li, The Chinese University of Hong Kong, Hong Kong
- Ying Li, Samsung Telecommunications America, USA
- Ying-Chang Liang, Institute for Infocomm Research, Singapore
- Chin Lin, National Taiwan-Ocean University, Taiwan
- Po-Chiang Lin, Yuan Ze University, Taiwan
- Wei-Cheng Lin, National Kaohsiung University of Applied Sciences, Taiwan
- Yih-Chuan Lin, National Formosa University, Taiwan
- Jia Liu, Ohio State University, USA
- Jiajia Liu, Tohoku University, Japan
- Liang Liu, Lund University, Sweden
- Wei Liu, University of Sheffield, United Kingdom
- Youjian (Eugene) Liu, University of Colorado at Boulder, USA
- Tat Lok, The Chinese University of Hong Kong, Hong Kong
- Enoch Lu, Qualcomm, USA
- Huang Lu, University of Tsukuba, Japan
- Lu Lu, The Chinese University of Hong Kong, Hong Kong
- King-Shan Lui, The University of Hong Kong, Hong Kong
- Jun Luo, Nanyang Technological University, Singapore
- JunZhou Luo, Southeast University, P.R. China
- Mon-Yen Luo, National Kaohsiung University of Applied Sciences, Taiwan
- Yuanqiu Luo, Huawei Technologies USA, USA
- Chris Yu Tak Ma, Advanced Digital Sciences Center, Illinois at Singapore, Singapore
- Yi Ma, University of Surrey, United Kingdom
- Ranjan Mallik, Indian Institute of Technology - Delhi, India
- Athanassios Manikas, Imperial College London, United Kingdom
- Hiroshi Mineno, Shizuoka University, Japan
- Andreas Muller, Robert Bosch GmbH, Germany
- Muhammad Naeem, Ryerson University, Canada
- Mort Naraghi-Pour, Louisiana State University, USA
- Keivan Navaie, University of Leeds, United Kingdom
- Pirabakaran Navaratnam, University of Surrey, United Kingdom
- Wai Pang Ng, Northumbria University, United Kingdom
- Qiang Ni, Brunel University, United Kingdom
- Keith Nolan, Trinity College Dublin, Ireland
- Atay Ozgovde, Galatasaray University, Turkey
- Jianping Pan, University of Victoria, Canada
- Miao Pan, Texas Southern University, USA
- Shivendra Panwar, Polytechnic Institute of New York University, USA
- Agisilaos Papadogiannis, Chalmers University of Technology, Sweden
- Parth Pathak, University of California, Davis, USA
- Yuexing Peng, Beijing University of Posts & Telecoms, P.R. China
- Raphael Phan, Loughborough University, United Kingdom
- Philip Pietraski, InterDigital Communications, USA
- Petar Popovski, Aalborg University, Denmark
- Chang-Woo Pyo, NICT, Japan
- Daiming Qu, Huazhong University of Science and Technology, Wuhan, Hubei, P.R. China
- Riccardo Raheli, University of Parma, Italy
- Tharmalingam Ratnarajah, The University of Edinburgh, United Kingdom
- Kiran Rege, Bell Laboratories, Alcatel-Lucent, USA
- Rodrigo Roman, Institute for Infocomm Research, Singapore
- Ahmed Saadani, Orange Labs, France
- Mamoru Sawahashi, Tokyo City University, Japan
- Miguel Sepulcre, University Miguel Hernandez of Elche, Spain
- Sushant Sharma, Brookhaven National Laboratory, USA
- Wern-Ho Sheen, Chaoyang University of Technology, Taiwan
- Cong Shen, Qualcomm, USA
- Yuan Shen, Massachusetts Institute of Technology, USA
- Chin-Shiuh Shieh, National Kaohsiung University of Applied Sciences, Taiwan
- Rajeev Shorey, Vice-Chancellor, NIIT University, India
- Kenneth Shum, Institute of Network Coding, Hong Kong
- Sumit Singh, Moseley Wireless Solutions Group, USA
- Wee-Seng Soh, National University of Singapore, Singapore
- Hui-Kai Su, National Formosa University, Taiwan
- Zhou Su, Waseda University, Japan
- Siva Subramani, Toshiba Research Europe Limited, United Kingdom
- Sumei Sun, Institute for Infocomm Research, Singapore
- Chi Wan Sung, City University of Hong Kong, Hong Kong
- Vincent Tam, University of Hong Kong, Hong Kong
- Chee Wei Tan, City University of Hong Kong, Hong Kong
- Liansheng Tan, Central China Normal University, P.R. China
- Wee Lum Tan, National ICT Australia, Australia
- Ravi Tandon, Virginia Tech, USA
- Po-Lung Tien, National Chiao Tung University, Taiwan
- Corinne Touati, INRIA - LIG Grenoble, France
- Long Tran-Thanh, University of Southampton, United Kingdom
- Shuoh Ren Tsai, National Kaohsiung First University of Science and Technology, Taiwan
- Chien-Cheng Tseng, National Kaohsiung First University of Science and Technology, Taiwan
- Hideyuki Uehara, Toyohashi University of Technology, Japan
- Hrishikesh Venkataraman, Dublin City University, Ireland
- Hai Vu, Swinburne University of Technology, Australia
- Chengxiang Wang, Heriot-Watt University, United Kingdom
- Chih-Chun Wang, Purdue University, USA
- Chin-Liang Wang, National Tsing Hua University, Taiwan
- Dongming Wang, National Mobile Communications Research Lab., Southeast University, P.R. China
- Lei Wang, Dalian University of Technology, P.R. China
- Ning Wang, University of Surrey, United Kingdom
- Rui Wang, The South University of Science and Technology of China, Hong Kong
- Stephen Lingfeng Wang, Toshiba Research Europe Limited, United Kingdom
- Xianbin Wang, The University of Western Ontario, Canada
- Xiaoyan Wang, University of Tsukuba, Japan
- Xudong Wang, Teranovi Technologies, Inc., USA
- You-Chiun Wang, National Sun Yat-Sen University, Taiwan
- Yonggang Wen, Nanyang Technological University, Singapore
- Kai Kit Wong, University College London, United Kingdom
- Pui King Wong, Hong Kong Baptist University, Hong Kong
- Vincent Wong, University of British Columbia, Canada
- Chuan Wu, The University of Hong Kong, Hong Kong
- Jingxian Wu, University of Arkansas, USA
- Jwo-Yuh Wu, National Chiao Tung University, Taiwan
- Ye Xia, University of Florida, USA
- Li Xiao, Michigan State University, USA
- Li Xu, Fujian Normal University, P.R. China
- Wen Xu, Intel, Germany
- Chunlin Yan, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
- Dejun Yang, Arizona State University, USA
- Kun Yang, University of Essex, United Kingdom
- Liuqing Yang, Colorado State University, USA
- Yang Yang, Shanghai Research Center for Wireless Communications, P.R. China
- Yu-Dong Yao, Stevens Institute of Technology, USA
- Xiucai Ye, University of Tsukuba, Japan
- Yung Yi, KAIST, Korea
- Yi Yuan-Wu, Orange Labs, France
- Hao Yue, University of Florida, USA
- Alenka Zajic, Georgia Institute of Technology, USA
- Ephraim Zehavi, Bar-Ilan University, Israel
- Kai Zeng, University of Michigan - Dearborn, USA
- Baoxian Zhang, Graduate University of the Chinese Academy of Sciences, P.R. China
- Honggang Zhang, Zhejiang University, P.R. China
- Hongwei Zhang, Wayne State University, USA
- Jialiang Zhang, The Chinese University of Hong Kong, P.R. China
- Jie Zhang, University of Sheffield, Dept. of Electronic and Electrical Engineering, United Kingdom
- Jingjing Zhang, Arista Networks, USA
- Qinqing Zhang, Johns Hopkins University, Applied Physics Laboratory, USA
- Shengli Zhang, Shenzhen University, P.R. China
- Wei Zhang, The University of New South Wales, Australia
- Yan Zhang, Simula Research Lab, Norway
- Ying Jun (Angela) Zhang, The Chinese University of Hong Kong, Hong Kong
- Zhaoyang Zhang, Zhejiang University, P.R. China
- Gan Zheng, University of Luxembourg, Luxemburg
- Jiazhen Zhou, University of Wisconsin - Whitewater, USA
- Sheng Zhou, Tsinghua University, P.R. China
- Wenan Zhou, Beijing University of Post and Telecom, Beijing, P.R. China
- Wei-Ping Zhu, Concordia University, Canada
Networks Track
- Nedal Ababneh, University of Bahrain, Bahrain
- Mohammad Abdul Azim, Masdar Institute, UAE
- Giuseppe Abreu, Jacobs University Bremen, Germany
- Ibrahim Abualhaol, Khalifa University, UAE
- Nadjib Achir, University of Paris 13, France
- Iwan Adhicandra, Bakrie University, Indonesia
- Dharma Agrawal, University of Cincinnati, USA
- Javier Aguiar, University of Valladolid, Spain
- Rui Aguiar, University of Aveiro, Portugal
- Toufik Ahmed, University of Bordeaux-1 / CNRS-LaBRI, France
- Ozgur Akan, Koc University, Turkey
- Arafat Al-Dweik, Khalifa University, UAE
- Fadi Al-Turjman, Queen's University, Canada
- Temitope Alade, University of Kent, United Kingdom
- Fatih Alagoz, Bogazici University, Turkey
- George Alexandropoulos, Athens Information Technology, Greece
- Nayef Alsindi, Khalifa University of Science, Technology and Research - KUSTAR, UAE
- Salah Aly, Princeton University, USA
- Habib M. Ammari, University of Michigan-Dearborn, USA
- Markos Anastasopoulos, Athens Information Technology, Greece
- Huseyin Arslan, University of South Florida, USA
- Mohamad Atia, Queens University, Canada
- Qutub Bakhtiar, Technological University of America, USA
- M Bala Krishna, Guru Gobind Singh Indraprastha University, DELHI, India
- Mohammad Banat, Jordan University of Science and Technology, Jordan
- Fenye Bao, Virginia Tech, USA
- Uthman Baroudi, King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
- Dominique Barthel, Orange Labs, France
- Mostafa Bassiouni, University of Central Florida, USA
- Osama Bazan, Huawei, Canada
- Tarek Bejaoui, University of Paris-Sud 11, France
- Abdeltouab Belbekkouche, University of Ottawa, Canada
- Paolo Bellavista, University of Bologna, Italy
- Racha Ben Ali, Ecole Polytechnique de Montreal, Canada
- Jalel Ben-Othman, University of Paris 13, France
- Mauro Biagi, Sapienza University of Rome, Italy
- Igor Bisio, University of Genoa, Italy
- Fernando Boavida, University of Coimbra, Portugal
- Mate Boban, Carnegie Mellon University, USA
- Patrick-Benjamin Boek, TU Dortmund, Germany
- Ravishankar Borgaonkar, Technical University, Berlin, Germany
- Fernando Boronat, Universitat Politecnica de Valencia, Spain
- Amar Ben Saber Boucif, University of Quebec, Trois Rivieres, Canada
- Azzedine Boukerche, University of Ottawa, Canada
- Ioannis Broustis, AT&T Labs Research, USA
- Chiara Buratti, University of Bologna, Italy
- Jun Cai, University of Manitoba, Canada
- Juan-Carlos Cano, Universidad Politecnica de Valencia, Spain
- Filipe Cardoso, ESTSetubal/Polytechnic Institute of Setubal, Portugal
- Chan-Byoung Chae, Yonsei University, Korea
- Chung-Ju Chang, National Chiao Tung University, Taiwan
- Periklis Chatzimisios, Alexander TEI of Thessaloniki, Greece
- Abdellah Chehri, University of Ottawa, Canada
- Hui Chen, Virginia State University, USA
- Jie Chen, University of California, Irvine, USA
- Jiming Chen, Zhejiang University, P.R. China
- Kwang-Cheng Chen, National Taiwan University, Taiwan
- Xiangqian Chen, Florida International University, USA
- Xiao Chen, Texas State University, USA
- Yung-Sheng Chen, Yuan Ze University, Taiwan
- Zesheng Chen, Indiana University - Purdue University Fort Wayne, USA
- Bo-Chao Cheng, National Chung Cheng University, Taiwan
- Julian Cheng, University of British Columbia, Canada
- Lin Cheng, Trinity College, USA
- Carla-Fabiana Chiasserini, Politecnico di Torino, Italy
- Feng-Tsun Chien, National Chiao Tung University, Taiwan
- Wen-Long Chin, National Cheng Kung University, Taiwan
- Sungyoon Cho, Yonsei University, Korea
- Chun Tung Chou, University of New South Wales, Australia
- Nicola Cordeschi, ''Sapienza'' University of Rome, Italy
- Laura Cottatellucci, EURECOM, France
- Felipe Cruz-Perez, Cinvestav-IPN, Mexico
- Marilia Curado, University of Coimbra, Portugal
- Arek Dadej, University of South Australia, Australia
- Hamza Dahmouni, INPT-Rabat, Morocco
- Marc De Leenheer, Open Networking Lab, USA
- Renato de Moraes, University of Brasilia (UnB), Brazil
- Luca De Nardis, University of Rome La Sapienza, Italy
- Carl Debono, University of Malta, Malta
- Marco Di Renzo, French National Center for Scientific Research (CNRS), France
- Mehrdad Dianati, University of Surrey, United Kingdom
- Gabi Dreo Rodosek, Universitat der Bundeswehr Munchen, Germany
- Falko Dressler, University of Innsbruck, Austria
- Qinghe Du, Xi'an Jiaotong University, P.R. China
- Chunjie Duan, Mitsubishi Electric Research Laboratories, USA
- Arjan Durresi, Indiana University Purdue University Indianapolis, USA
- Stephan Eidenbenz, Los Alamos National Laboratory, USA
- May El Barachi, Zayed University, UAE
- Mohamed El-Tarhuni, American University of Sharjah, UAE
- Khaled Elsayed, Cairo University, Egypt
- Mohamed Eltoweissy, Virginia Tech, USA
- Ozgur Ercetin, Sabanci University, Turkey
- Jeffrey Evans, Purdue University, USA
- Zubair Fadlullah, Tohoku University, Japan
- Shih-Hau Fang, Yuan Ze University, Taiwan
- Nazbanoo Farzaneh, Ferdowsi University of Mashhad, Iran
- Lorenzo Favalli, University of Pavia, Italy
- Wissam Fawaz, LAU, Lebanon
- Emad Felemban, Umm Al Qura University, Saudi Arabia
- Stenio Fernandes, Federal University of Pernambuco, Brazil
- Huei-Wen Ferng, National Taiwan University of Science and Technology, Taiwan
- Manuel Ferreira, Instituto Superior Tecnico - Technical University of Lisbon, Portugal
- Fethi Filali, QMIC, Qatar
- Stefan Fischer, University of Lubeck, Germany
- Jeffrey Foerster, Intel Corporation, USA
- Chuan Heng Foh, Nanyang Technological University, Singapore
- Pedro Forero, SPAWAR Systems Center Pacific, USA
- Weihuang Fu, Cisco Systems, USA
- Zhang Fu, Chalmers University of Technology, Sweden
- Yasser Gadallah, The American University in Cairo, Egypt
- Laura Galluccio, DIEEI, University of Catania, Italy
- Xiaoying Gan, Shanghai Jiao Tong University, P.R. China
- Weihua Gao, Qualcomm Inc., USA
- Damianos Gavalas, University of the Aegean, Greece
- Amjad Gawanmeh, Khalifa University of Science, Technology and Research, UAE
- Konstantinos Georgakilas, Athens Information Technology, Greece
- Yacine Ghamri-Doudane, ENSIIE & Universite Paris-Est (LIGM Lab), France
- Weihan Goh, Nanyang Technological University, Singapore
- Steven Gordon, Thammasat University, Thailand
- Dhrubajyoti Goswami, Concordia University, Canada
- Sumit Goswami, Defence Research and Development Organisation, Ministry of Defence, India
- Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
- Annie Gravey, Institut Mines Telecom - Telecom Bretagne, France
- Daniel Guidoni, Federal University of Sao Joao Del-Rei, Brazil
- Sghaier Guizani, Alfaisal University, Saudi Arabia
- Song Guo, The University of Aizu, Japan
- Zhen Guo, Wireless Innovation Group R&D, Commscope, USA
- Zygmunt Haas, Cornell University, USA
- Yassine Hadjadj-Aoul, University of Rennes 1, France
- Abdelhakim Hafid, University of Montreal, Canada
- Zeeshan Hameed Mir, Electronics & Telecommunications Research Institute (ETRI), Korea
- Biao Han, University of Tsukuba, Japan
- Sang-wook Han, Royal Institute of Technology (KTH), Sweden
- Zhu Han, University of Houston, USA
- Petr Hanacek, Brno University of Technology, Czech Republic
- Jahan Hassan, University of New South Wales, Australia
- Yieh-Ran Haung, Yuan Ze University, Taiwan
- Daojing He, Zhejiang University, P.R. China
- Jianhua He, Aston University, United Kingdom
- Jun He, University of Arizona, USA
- Michael Hempel, University of Nebraska-Lincoln, USA
- Yao H. Ho, National Taiwan Normal University, Taiwan
- Roger Pierre Hoefel, Federal University of Rio Grande do Sul, Brazil
- Liang Hong, Tennessee State University, USA
- Zhihong Hong, Communications Research Centre, Canada
- Xiaolin Hou, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
- Jiankun Hu, University of New South Wales, Australia
- Wen Hu, Commonwealth Scientific and Industrial Research Organisation (CSIRO), Australia
- Cunqing Hua, Shanghai Jiao Tong University, P.R. China
- Jeng-Ji Huang, National Taiwan Normal University, Taiwan
- Pei Huang, Michigan State University, USA
- Xiaoxia Huang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P.R. China
- Yueh-Min Huang, National Cheng Kung University, Taiwan
- Pan Hui, Deutsche Telekom Laboratories, Germany
- Salama Ikki, Newcastle University, UK
- Kenji Ishida, Hiroshima City University, Japan
- Hiroyasu Ishikawa, Nihon University, Japan
- Lillykutty Jacob, National Institute of Technology Calicut, India
- Gentian Jakllari, University of Toulouse, France
- Hadi Jamali-Rad, Delft University of Technology (TU Delft), The Netherlands
- Brigitte Jaumard, Concordia University, Canada
- Aruna Jayasuriya, Central Queensland University, Australia
- Yusheng Ji, National Institute of Informatics, Japan
- Anxiao Andrew Jiang, Texas A&M University, USA
- Canming Jiang, Cisco Systems, USA
- Hongbo Jiang, Huazhong University of Science and Technology, P.R. China
- Tao Jiang, Huazhong University of Science and Technology, P.R. China
- Xiaohong Jiang, Future University-Hakodate, Japan
- Yan Jin, Chinese Academy of Sciences, Institute of Computing Technology, P.R. China
- Andrew Jones, KUSTAR, UAE
- Volker Jungnickel, Fraunhofer Heinrich Hertz Institute, Germany
- Rossi Kamal, Kyung Hee University, Korea
- Suguru Kameda, Tohoku University, Japan
- Megumi Kaneko, Kyoto University, Japan
- Salil Kanhere, The University of New South Wales, Australia
- Kimmo Kansanen, Norwegian University of Science and Technology, Norway
- Masoumeh Karimi, Technological University of America (TUA), USA
- Holger Karl, University of Paderborn, Germany
- Premkumar Karumbu, SSN College of Engineering, India
- Ibrahim Khalil, Faculty member, RMIT University, Australia
- Jamil Khan, The University of Newcastle, Australia
- Tamer Khattab, Qatar University, Qatar
- Chadi Khirallah, The University of Edinburgh, United Kingdom
- Ashish Khisti, University of Toronto, Canada
- Dong Ku Kim, Yonsei University, Korea
- Seong-Lyun Kim, Yonsei University, Korea
- Adrian Kliks, Poznan University of Technology, Poland
- R. Prasad Kodaypak, Senior Member IEEE, USA
- Panayiotis Kolios, University of Cyprus, Cyprus
- Peng-Yong Kong, Khalifa University of Science, Technology & Research (KUSTAR), UAE
- Charalampos Konstantopoulos, University of Piraeus, Greece
- Georgios Kormentzas, University of the Aegean, Greece
- Ibrahim Korpeoglu, Bilkent University, Turkey
- Polychronis Koutsakis, Technical University of Crete, Greece
- Ioannis Krikidis, University of Cyprus, Cyprus
- Adlen Ksentini, University of Rennes 1 / IRISA Lab, France
- Wen-Kuang Kuo, National Cheng Kung University, Taiwan
- Yann Labit, LAAS-CNRS, Universite de Toulouse, France
- Abderrahmane Lakas, UAEU, UAE
- Rami Langar, UPMC - University of Paris 6, France
- Long Le, INRS, University of Quebec, Canada
- Heung-No Lee, Gwangju Institute of Science and Technology, Korea
- Howon Lee, Hankyong National University, Korea
- Jack Y. B. Lee, The Chinese University of Hong Kong, Hong Kong
- Jang-Won Lee, Yonsei University, Korea
- Jeng Farn Lee, National Chung Cheng University, Taiwan
- Sung-Won Lee, Ajou University, Korea
- Ka-Cheong Leung, The University of Hong Kong, Hong Kong
- Victor Leung, The University of British Columbia, Canada
- Cheng Li, Memorial University of Newfoundland, Canada
- Chenglin Li, Shanghai Jiao Tong University, P.R. China
- Jingli Li, TopWorx, USA
- Jun Li, Communications Research Centre of Canada, Canada
- Mo Li, Nanyang Technological University, Singapore
- Tiffany Jing Li, Lehigh University, USA
- Yun Li, ChongQing University of Posts and Telecommunications of China, P.R. China
- Zhu Li, Samsung Telecom America, USA
- Yao Liang, Indiana University Purdue University Indianapolis, USA
- Wanjiun Liao, National Taiwan University, Taiwan
- Teng Joon Lim, National University of Singapore, Singapore
- Di Lin, McGill University, Canada
- Kai Lin, Dalian University of Technology, P.R. China
- Phone Lin, National Taiwan University, Taiwan
- Marco Listanti, University of Rome "La Sapienza", Italy
- Bing-Hong Liu, National Kaohsiung University of Applied Sciences, Taiwan
- Tsung-Hsien Liu, National Chung Cheng University, Taiwan
- Wei Liu, Huazhong University of Science and Technology, P.R. China
- Gianluigi Liva, DLR - German Aerospace Center, Germany
- Errol Lloyd, University of Delaware, USA
- Anthony Lo, Delft University of Technology, The Netherlands
- Pavel Loskot, Swansea University, United Kingdom
- Haiyan Luo, Cisco Systems, USA
- Tie Luo, Institute for Infocomm Research, Singapore
- Xun Luo, Qualcomm, Inc, USA
- Maode Ma, Nanyang Technological University, Singapore
- Shaodan Ma, University of Macau, P.R. China
- Mike MacGregor, University of Alberta, Canada
- Maurizio Magarini, Politecnico di Milano, Italy
- Thomas Magedanz, Fraunhofer FOKUS / TU Berlin, Germany
- Dario Maggiorini, University of Milano, Italy
- Sahibzada Ali Mahmud, University of Engineering and Technology, Peshawar, Pakistan
- Petri Mahonen, RWTH Aachen University, Germany
- Quazi Mamun, Charles Sturt University, Australia
- Patrick Marsch, Nokia Siemens Networks, Poland
- Jorge Martinez-Bauset, Universitat Politecnica de Valencia, Spain
- Ronald Marx, Fraunhofer SIT, Germany
- Barbara Masini, IEIIT-CNR, Italy
- Djamal-Eddine Meddour, Orange Labs, France
- Natarajan Meghanathan, Jackson State University, USA
- Ahmed Mehaoua, University of Paris Descartes, France
- Abdelhamid Mellouk, UPEC, University Paris-Est Creteil Val de Marne, France
- Maria Luisa Merani, University of Modena and Reggio Emilia, Italy
- Lusheng Miao, Tshwane University of Technology, South Africa
- Vicente Milanes, University of California Berkeley, USA
- Daniele Miorandi, Create-Net, Italy
- Jelena Misic, Ryerson University, Canada
- Amin Mobasher, Broadcom Corporation, USA
- Seshadri Mohan, University of Arkansas at Little Rock, USA
- Lynda Mokdad, Universite de Paris 12, France
- Sandor Molnar, Budapest University of Technology and Economics, Hungary
- Mehul Motani, National University of Singapore, Singapore
- Lorenzo Mucchi, University of Florence, Italy
- Amitava Mukherjee, IBM India Pvt Ltd, Calcutta, India
- Hidekazu Murata, Kyoto University, Japan
- Mirco Musolesi, University of Birmingham, United Kingdom
- Tamer Nadeem, Old Dominion University, USA
- Eduardo Nakamura, FUCAPI - Research and Technological Innovation Center, Brazil
- Seung Yeob Nam, Yeungnam University, Korea
- Kamesh Namuduri, University of North Texas, USA
- Amiya Nayak, SITE, University of Ottawa, Canada
- Petros Nicopolitidis, Aristotle University, Greece
- Hong Nie, University of Northern Iowa, USA
- Jianwei Niu, Beihang University, P.R. China
- Dusit Niyato, Nanyang Technological University, Singapore
- Josiane Nzouonta, New Jersey Institute of Technology, USA
- Dominic O'Brien, Oxford University, United Kingdom
- Eng Hwee Ong, Infocomm Development Authority of Singapore, Singapore
- Ertan Onur, Delft University of Technology, The Netherlands
- Hadi Otrok, Khalifa University of Science, Technology & Research (KUSTAR), UAE
- Shumao Ou, Oxford Brookes University, United Kingdom
- Ertan Ozturk, Zonguldak Karaelmas University, Turkey
- Diego Pacheco-Paramo, Universidad Politecnica de Valencia, Spain
- Sangheon Pack, Korea University, Korea
- Grammati Pantziou, Technological Educational Institution of Athens, Greece
- Enrico Paolini, DEI, University of Bologna, Italy
- Stylianos Papaharalabos, Athens Information Technology, Greece
- Evangelos Papapetrou, University of Ioannina, Greece
- Josep Paradells, Universitat Politecnica de Catalunya. BarcelonaTech (UPC), Canada
- Hyunggon Park, Ewha Womans University, Korea
- Fotini-Niovi Pavlidou, Aristotle University of Thessaloniki, Greece
- Richard Pazzi, University of Ontario Institute of Technology, Canada
- Jhoanna Rhodette Pedrasa, University of the Philippines, Philippines
- Bo Peng, University of Bristol, United Kingdom
- Shuping Peng, University of Bristol, United Kingdom
- Wuxu Peng, Texas State University, USA
- Kostas Pentikousis, Huawei Technologies, Germany
- Dirk Pesch, Cork Institute of Technology, Ireland
- Fabrice Peyrard, University of Toulouse, France
- Tom Pfeifer, Technische Universitat Berlin, Germany
- Niki Pissinou, Florida International University, USA
- Anand Prasad, NEC Corporation, Japan
- Pratap Prasad, Qualcomm Inc, USA
- Yi Qian, University of Nebraska Lincoln, USA
- Xin Qiu, Harbin Institute of Technology, P.R. China
- Hamid Rabiee, Sharif University of Technology, Iran
- Redha Radaydeh, Alfaisal University, Saudi Arabia
- Ayman Radwan, Instituto de Telecomunicacoes, Portugal
- Marco Roccetti, University of Bologna, Italy
- Joel Rodrigues, Instituto de Telecomunicacoes, University of Beira Interior, Portugal
- Michele Rossi, University of Padova, Italy
- Javier Rubio-Loyola, CINVESTAV Tamaulipas, Mexico
- Humphrey Rutagemwa, Communications Research Centre (CRC) Canada, Canada
- Brian Sadler, Army Research Laboratory, USA
- Yalin Sagduyu, Intelligent Automation, Inc., USA
- Konstantinos Samdanis, NEC Europe Ltd., Germany
- Cesar Santivanez, BBN Technologies, USA
- Nurul Sarkar, Auckland University of Technology, New Zealand
- Vladimir Savic, Linkoping University, Sweden
- Thomas Schierl, Fraunhofer HHI, Germany
- Jens Schmitt, University of Kaiserslautern, Germany
- Hangguan Shan, Zhejiang University, P.R. China
- Yi Shang, University of Missouri, USA
- Junyang Shen, University of Southern California, USA
- Yanyan Shen, City University of Hong Kong, Hong Kong
- Nirmala Shenoy, University of Rochester, USA
- Gaotao Shi, Tianjin University, P.R. China
- Jing Shi, Huazhong University of Science and Technology, P.R. China
- Liqi Shi, Sandvine Inc, Canada
- Zhefu Shi, Microsoft, USA
- Basem Shihada, KAUST, Saudi Arabia
- Lei Shu, Guangdong University of Petrochemical Technology, P.R. China
- Tong Shu, Institute of Computing Technology, Chinese Academy of Sciences, P.R. China
- Nina Skorin-Kapov, University of Zagreb, Croatia
- Wei Song, University of New Brunswick, Canada
- Yi Song, University of North Carolina at Charlotte, USA
- Burkhard Stiller, University of Zurich, Switzerland
- John Strassner, Huawei, USA
- Tim Strayer, BBN Technologies, USA
- Akshya Swain, University of Auckland, New Zealand
- Abd-Elhamid Taha, Alfaisal University, Saudi Arabia
- Glen Takahara, Queen's University, Canada
- Mineo Takai, University of California, Los Angeles, USA
- Daniele Tarchi, University of Bologna, Italy
- Inés Tejado, Universidad de Extremadura, Spain
- Terence D. Todd, McMaster University, Canada
- Ali Tosun, University of Texas at San Antonio, USA
- Nghi Tran, University of Akron, USA
- Danny Tsang, HKUST, Hong Kong
- Shiao-Li Tsao, National Chiao Tung University, Taiwan
- Huei-Ru Tseng, Industrial Technology Research Institute, Taiwan
- Pei-Chen Tseng, Tzu Chi College of Technology, Taiwan
- Hiroshi Tsunoda, Tohoku Institue of Technology, Japan
- Wanqing Tu, Nottingham Trent University, United Kingdom
- Damla Turgut, University of Central Florida, USA
- Anna Tzanakaki, AIT, Greece
- Sennur Ulukus, University of Maryland, USA
- Fabrice Valois, INSA Lyon, France
- Athanasios Vasilakos, National Technical University of Athens, Greece
- Rahul Vaze, TIFR Mumbai, India
- Alexey Vinel, Tampere University of Technology, Finland
- Tiago Vinhoza, Instituto de Telecomunicacoes, Portugal
- Serdar Vural, University of Surrey, United Kingdom
- Sonia Waharte, University of Bedforshire, United Kingdom
- Chih-Chiang Wang, National Kaohsiung University of Applied Sciences, Taiwan
- Chonggang Wang, InterDigital Communications, USA
- Dandan Wang, Alcatel-Lucent, USA
- Hao Wang, Southeast University, P.R. China
- Jianfeng Wang, Philips Research, USA
- Jingning Wang, The 54th Research Institute of China Electronics Technology Group Corporation, P.R. China
- Li-Chun Wang, National Chiao Tung University, Taiwan
- Shaowei Wang, Nanjing University, P.R. China
- Wei Wang, South Dakota State University, USA
- Weichao Wang, University of North Carolina at Charlotte, USA
- Yu Wang, University of North Carolina at Charlotte, USA
- Christian Wietfeld, TU Dortmund University, Germany
- Adam Wolisz, Technical University of Berlin, Germany
- Eric Wong, Broadcom, USA
- Bin Wu, Tianjin University, P.R. China
- Xuanli Wu, Communication Research Center, Harbin Institute of Technology, P.R. China
- Weidong Xiang, University of Michigan, Dearborn, USA
- Ming Xiao, Royal Institute of Technology, Sweden
- Hongkai Xiong, Shanghai Jiao Tong University, P.R. China
- Kunjie Xu, University of Pittsburgh, USA
- Miki Yamamoto, Kansai University, Japan
- Wei Yan, McAfee, USA
- Panlong Yang, Institute of Communication Engineering, PLAUST, P.R. China
- Fei Ye, University Washington, USA
- Qiang Ye, University of Prince Edward Island, Canada
- Chia-Hung Yeh, National Sun Yat-Sen University, Taiwan
- Mohamed Younis, University of Maryland Baltimore County, USA
- Wei Yuan, Huazhong University of Science and Technology, P.R. China
- Zhenhui Yuan, Dublin City University, Ireland
- Murat Yuksel, University of Nevada - Reno, USA
- David Zage, Sandia National Laboratories, USA
- Andrea Zanella, University of Padova, Italy
- Qing-An Zeng, North Carolina A&T State University, USA
- Chi Zhang, University of Science and Technology of China, P.R. China
- Daqiang Zhang, Nanjing Normal University, P.R. China
- Tao Zhang, New York Institute of Technology, USA
- Yan Zhang, Simula Research Laboratory and University of Oslo, Norway
- Lei Zhong, National Institute of Information and Communications Technology (NICT), Japan
- Hao Zhu, Qualcomm Inc, USA
- Haojin Zhu, Shanghai Jiao Tong University, P.R. China
- Yi-hua Zhu, Zhejiang University of Technology, P.R. China
Services and Applications Track
- Sachin Agarwal, NEC Europe Ltd., Laboratories, Germany
- Mari Carmen Aguayo-Torres, University of Malaga, Spain
- Ozgur Akan, Koc University, Turkey
- Kemal Akkaya, Southern Illinois University Carbondale, USA
- Temitope Alade, University of Kent, United Kingdom
- Tricha Anjali, Illinois Institute of Technology, USA
- Payam Barnaghi, University of Surrey, United Kingdom
- Jiannong Cao, Hong Kong Polytechnic Univ, Hong Kong
- Pietro Cassarà , University of Palermo, Italy
- Pasquale Cataldi, British Sky Broadcasting Ltd, United Kingdom
- Yi-Cheng Chan, National Changhua University of Education, Taiwan
- Ing-Chau Chang, National Changhua University of Education, Taiwan
- Yao-Chung Chang, Natioal Taitung University, Taiwan
- Chien-Liang Chen, Aletheia University, Taiwan
- Hui Chen, Virginia State University, USA
- Lei Chen, Harbin Institute of Technology, P.R. China
- Min-Xiou Chen, National Dong Hwa University, Taiwan
- Wei-Yeh Chen, Southern Taiwan University of Science and Technology, Taiwan
- Yeong-Sheng Chen, National Taipei University of Education, Taiwan
- Zhi Chen, University of Electronic Science and Technology of China, P.R. China
- Rung-Shiang Cheng, Kun Shan University, Taiwan
- Zhang Chengwen, Harbin Institute of Technology, P.R. China
- Hui-Hsin Chin, National Changhua University of Education, Taiwan
- Li-Der Chou, National Central University, Taiwan
- Yeh-Ching Chung, National Tsing Hua University, Taiwan
- Jorge Cuellar, Siemens AG, Germany
- Der Jiunn Deng, National Changhua University of Education, Taiwan
- Roberto Di Pietro, Università di Roma Tre, Italy
- Jen-Wen Ding, National Kaohsiung University of Applied Sciences, Taiwan
- Min Ding, NEC Laboratories America, USA
- Wei Ding, New York Institute of Technology, USA
- Lisheng Fan, Shantou University, P.R. China
- Jeffrey Foerster, Intel Corporation, USA
- Anna Forster, University of Applied Sciences of Southern Switzerland, Switzerland
- Shengli Fu, University of North Texas, USA
- Alex Galis, University College London, United Kingdom
- Zhenguo Gao, Harbin Engineering University, P.R. China
- Juan Gonzalez Nieto, Information Security Institute, Queensland University of Technology, Australia
- Diego Gonzalez-Aguilera, University of Salamanca, Spain
- Sathish Gopalakrishnan, University of British Columbia, Canada
- Yong Guan, Iowa State University, USA
- Minghuang Guo, Shih Hsin University, Taiwan
- Congzheng Han, Ofcom, United Kingdom
- Shuai Han, Harbin Institute of Technology, P.R. China
- Jianhua He, Aston University, United Kingdom
- Yejun He, Shenzhen University, P.R. China
- Erol Hepsaydir, Hutchison 3G, United Kingdom
- Zhihong Hong, Communications Research Centre, Canada
- Meng yen Hsieh, Providence University, Taiwan
- Ching-Hsien Hsu, Chung Hua University, Taiwan
- Robert Hsu, TBD, USA
- Wu-Hsiao Hsu, Ming Chuan University, Taiwan
- Jiankun Hu, University of New South Wales, Australia
- Rose Qingyang Hu, Utah State University, USA
- Min Jia, Harbin Institute of Technology, P.R. China
- Yupeng Jia, National Instruments, USA
- Jiyu Jin, Dalian Polytechnic University, P.R. China
- Sokratis Katsikas, University of Piraeus, Greece
- Chih-Heng Ke, National Kinmen Institute of Technology, Taiwan
- Abdellatif Kobbane, ENSIAS, University Mohmmed V-Souissi, Morocco
- Chia-Han Lee, Academia Sinica, Taiwan
- Jong-Hyouk Lee, TELECOM Bretagne, France
- Xianfu Lei, Utah State University, USA
- Guodong Li, Harbin University of Science and Technology, P.R. China
- Husheng Li, University of Tennessee, USA
- Li Li, Wuhan University, P.R. China
- Ming Li, Utah State University, USA
- Chu-Hsing Lin, Tunghai University, Taiwan
- Chun-Cheng Lin, National Chiao Tung University, Taiwan
- Xiaodong Lin, University of Ontario Institute of Technology, Canada
- Bo Liu, Shanghai Jiao Tong University, P.R. China
- Gongliang Liu, Harbin Institute of Technology, P.R. China
- Kejie Lu, University of Puerto Rico at Mayaguez, Puerto Rico
- Rongxing Lu, University of Waterloo, Canada
- Lin Ma, Harbin Institute of Technology, P.R. China
- Ruofei Ma, Harbin Institute of Technology, P.R. China
- Mahesh Marina, The University of Edinburgh, United Kingdom
- Lin Mei, Harbin Institute of Technology, P.R. China
- Weixiao Meng, Harbin Institute of Technology, P.R. China
- Klaus Moessner, University of Surrey, United Kingdom
- Enrico Natalizio, Universite de Technologie de Compiegne, France
- Symeon Papavassiliou, Institute of Comm. and Comp. Systems/National Technical University of Athens, Greece
- Mugen Peng, Beijing University of posts & Telecommunications, P.R. China
- Sheng-Lung Peng, National Dong Hwa University, Taiwan
- Pekka Pirinen, University of Oulu, Finland
- Beiyu Rong, Marvell Semiconductor, Inc, USA
- Bo Rong, Communications Research Center Canada, Canada
- Cristina Serban, AT&T Security Research Center, USA
- Shuo Shi, Harbin Intitute of Technology, P.R. China
- Yi Shi, Intelligent Automation Inc., USA
- Zhefu Shi, Microsoft, USA
- Kuei-Ping Shih, Tamkang University, Taiwan
- T-f Shih, Chaoyang University of Technology, Taiwan
- Sok-Ian Sou, National Cheng Kung University, Taiwan
- Dirk Trossen, University of Cambridge, United Kingdom
- Shiao-Li Tsao, National Chiao Tung University, Taiwan
- Honggang Wang, University of Massachusetts, Dartmouth, USA
- Pi-Chung Wang, National Chung Hsing University, Taiwan
- Tsan-Pin Wang, National Taichung University, Taiwan
- Lili Wei, Shanghai Jiao Tong University, P.R. China
- Richard Wolff, Montana State University, USA
- Chao-Chin Wu, NCUE, Taiwan
- Fan Wu, Shanghai Jiao Tong University, P.R. China
- Jinsong Wu, Bell Laboratories, P.R. China
- Tin-Yu Wu, National Ilan University, Taiwan
- Donglin Xia, Microsoft, USA
- Zhiqiang Xing, North China University of Technology, P.R. China
- Chao Yang, Xidian University, USA
- Chao-Tung Yang, Tunghai University, Taiwan
- Ching-Nung Yang, National Dong Hwa University, Taiwan
- Ming-Chuan Yang, Harbin Institute of Technology, P.R. China
- Shun-Ren Yang, NTHU, Taiwan
- Liang Ye, Harbin Institute of Technology, P.R. China
- Qiyue Yu, Harbin Institute of Technology, P.R. China
- Wei Yu, Towson University, USA
- Sherali Zeadally, University of the District of Columbia, USA
- Mu Zhou, Chongqing University of Posts and Telecommunications, P.R. China
- Zhangbing Zhou, Institute Telecom, France
- Zuqing Zhu, University of Science and Technology of China, P.R. China
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